Purion Power Series Features 300mm Thin Wafer Handling Capability
Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today announced follow on shipments of the Company’s Purion XE(TM) high energy and Purion M(TM) medium current Power Series(TM) implanters to a leading power device chipmaker located in Japan. The systems will be used in high volume production of 300mm thin silicon wafer based MOSFET and IGBT devices for automotive and other power management applications.
Executive Vice President of Product Development, Bill Bintz, commented, “The unique capabilities of the Purion Power Series, combined with the implant-intensive nature of the power device segment, uniquely positions Axcelis to benefit from growth in this market. These tools incorporate features and process control capabilities, including the platform’s thin wafer handling capability, that are enabling for the power device market. We look forward to expanding the Purion platform footprint in Japan and supporting our customers’ goals to increase their manufacturing capacity.”
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support ( https://c212.net/c/link/?t=0&l=en&o=3489522-1&h=475005267&u=http%3A%2F%2Fwww.axcelis.com%2Fsupport-programs%2Fglobal-support-solutions&a=complete+life+cycle+support ) of ion implantation ( https://c212.net/c/link/?t=0&l=en&o=3489522-1&h=3928044728&u=http%3A%2F%2Fwww.axcelis.com%2Fproducts%2Fion-implant&a=ion+implantation ) systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
SOURCE Axcelis Technologies, Inc.