Electrically conductive adhesive from Henkel designed to accommodate compact camera module complexity
By asianet
Novel formulation for grounding applications provides room-temperature moisture cure capability to protect heat-sensitive substrates while improving yield and enhancing reliability Henkel continues to lead in consumer electronic material solutions and today announced its latest innovation, an electrically conductive adhesive (ECA) that cures at room temperature, improving yield rates and protecting sensitive structures within mobile device … Continued