Country for PR: China
Contributor: PR Newswire Asia (China)
Friday, April 09 2021 - 11:00
AsiaNet
JCET Subsidiaries Receive the 2020 Supplier Excellence Award from Texas Instruments
SHANGHAI, April 8, 2021 /PRNewswire-AsiaNet/ --

JCET subsidiaries, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) and 
STATS ChipPAC Korea Co., LTD ("SCK") each received the 2020 Supplier Excellence 
Award from Texas Instruments (TI) for their outstanding IC manufacturing and 
technical services. The Supplier Excellence Award is the highest recognition 
given by TI to its elite suppliers, and its qualifications are based on: cost 
control capability, environmental and social responsibility, technological 
innovations, rapid response capability, supply assurance capability and product 
quality. In 2020, TI did business with over 12,000 suppliers and JCAP and SCK 
received the Supplier Excellence Award for their outstanding partnerships.

As a key industry source for wafer-level products, JCAP has the world's leading 
R&D and production capacity for advanced wafer-level packaging, including 
high-density fan-out solution and 2.5D high-density wafer-level packaging. This 
is the fifth time that JCAP has received the Supplier Excellence Award. Ms. 
Cynthia Zheng, General Manager of JCAP, said, "JCAP has been providing 
middle-end packaging, testing services and new technology development for TI 
for many years and has been awarded the Supplier Excellence Award five times. 
The award not only reflects the recognition from TI toward JCAP's technical and 
service capabilities, but also inspires us to continue to innovate and provide 
even better services to our customers!"

SCK's strategic focus includes the application markets of 5G communication, 
computing, industrial and consumer electronics while also continuing to expand 
and innovate in the popular application fields of automotive and information 
communication. As JCET's operational center in Korea, SCK is focused on 
development and production of the world's top-tier high-density packaging 
solutions, providing customers with best-in-class technology for 
system-in-package (SiP), wafer-level packaging and automotive-grade flip chip 
packaging and testing technologies. TI is one of the most important strategic 
partners for SCK.  Mr. WonGyou Kim, General Manager of SCK, said: "TI's 
Supplier Excellence Award is an affirmation of the partnership we have 
developed over the years and it also lays a solid foundation for strengthening 
our future cooperation. SCK will use this momentum to help further strengthen 
the ties between TI and SCK, as well as JCET group as a whole, bringing even 
bigger success to our partnership!"

In recent years, JCET has continued to expand the integration of resources and 
synergies among its global manufacturing bases with each of its subsidiaries 
having significantly improved their chipset manufacturing and technical service 
capabilities, while developing a successful business strategy based on scale 
and internationalization. "With a global vision to drive innovation and 
differentiations, JCET has accumulated rich technology and service 
capabilities, and has become the most trusted partner for many of our customers 
across the globe." said Mr. Li Zheng, Chief Executive Officer of JCET.  "As key 
business units of JCET, JCAP and SCK's customer award proves that our JCET 
business strategy of internationalization and professional development is 
paying off. Our company is driven to work around 'customer focus' as a core 
value, providing leading chipset manufacturing services, and creating the best 
value for our global customers."

About JCET

JCET is a leading global provider of integrated circuit manufacturing and 
technology services, offering a full range of turnkey solutions for chipset 
manufacturing, ranking 3rd in the world and 1st in mainland China.

Founded in 1972, JCET employs over 23,000 people worldwide and has operations 
in over 22 countries and regions. With more than 3,200 patents, six 
manufacturing powerhouse in China, Korea and Singapore, and two R&D centers, 
JCET is committed to working closely with global customers.

JCET's full range of turnkey services include semiconductor package integration 
design and characterization, R&D, wafer probe, wafer bumping, package assembly, 
final test and drop shipment to vendors around the world. JCET's products, 
services and technologies are used for mainstream IC system applications 
including network communications, high performance computing, automotive 
electronics, mass storage, and other areas.

About JCAP

JCAP is one of the key subsidiaries of JCET Group Co., Ltd., specializing in 
semiconductor mid-end packaging and testing technology and providing advanced 
technology services for chipset manufacturing to customers worldwide. 

About SCK

As a proud member of JCET Group Co., Ltd., SCK is one of the group's global 
semiconductor packaging and test providers offering a full range of turnkey 
services including design and characterization, wafer bump, probe, assembly, 
final test and system level testing.

SOURCE  JCET Group

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   Caption: 2020 TI SEA

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